DocumentCode
3495686
Title
High-performance, 3D-microtransformers on multilayered magnetic cores
Author
Moazenzadeh, Ali ; Spengler, Nils ; Wallrabe, U.
Author_Institution
Dept. of Microsyst. Eng.-IMTEK, Univ. of Freiburg, Freiburg, Germany
fYear
2013
fDate
20-24 Jan. 2013
Firstpage
287
Lastpage
290
Abstract
We present the fabrication of 3D-microtransformers combining a new type of multilayered magnetic core and coil winding with an automatic wirebonder. For the magnetic cores we stapled up to 30 layers of 20 μm thick amorphous metal layers with an industrial laminator. Intermediate layers of 10 μm thick double-sided sticky tape provided adhesion and electrical insulation. Electrical discharge machining was used to precisely cut these magnetic stacks to sub-millimeter cubes. To flip the cubes by 90° and assemble them onto a wafer for coil winding, we produced a receptor wafer providing magnetic landing sites. Subsequently, to wind a primary and secondary coil, one on top of the other, an automatic wirebonder was employed with 25 μm thick insulated Gold wire. A fabricated transformer with a core size of 0.9*0.8*1 mm3 yielded an inductance of 1412 nH and a coupling factor of 97%. The maximum transformer efficiency of 73% was measured at a load of 50 Ω.
Keywords
coils; electrical discharge machining; gold; lead bonding; micromachining; transformer cores; transformer windings; 3D microtransformer fabrication; adhesion; amorphous metal layers; automatic wirebonder; coil receptor wafer; coil winding; double-sided sticky tape; efficiency 73 percent; electrical discharge machining; electrical insulation; fabricated transformer; gold wire; high-performance 3D microtransformers; industrial laminator; magnetic landing sites; magnetic stacks; multilayered magnetic core; primary coil; resistance 50 ohm; secondary coil; size 10 mum; size 20 mum; size 25 mum; sub-millimeter cubes; transformer efficiency; Amorphous magnetic materials; Coils; Fabrication; Magnetic cores; Power transformer insulation; Substrates; Windings;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems (MEMS), 2013 IEEE 26th International Conference on
Conference_Location
Taipei
ISSN
1084-6999
Print_ISBN
978-1-4673-5654-1
Type
conf
DOI
10.1109/MEMSYS.2013.6474234
Filename
6474234
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