DocumentCode
3495864
Title
Integration of single-walled carbon nanotube bundle on cantilever by dielectrophoresis
Author
Chikamoto, T. ; Shimada, Yusuke ; Umetsu, M. ; Sugiyama, Masakazu
Author_Institution
3D BEANS Center, BEANS Project, Tokyo, Japan
fYear
2013
fDate
20-24 Jan. 2013
Firstpage
319
Lastpage
322
Abstract
We report on the assembly process for single-walled carbon nanotubes (SW-CNTs) bundle on the tip of cantilever for atomic force microscopy (AFM) by dielectrophoresis (DEP). In DEP process, an ac electric field (20 Vp-p, 5 MHz) was applied between a tungsten probe and the cantilever tip to form the SW-CNTs bundle bridge. We can monitor the SW-CNTs bridging process in real time under an optical microscope and successfully assembled SW-CNTs bundle with a diameter of approximately 100 nm on the tip. To compare the performance of our fablicated CNT cantilever with conventional cantilevers, we scanned a porous aluminum surface using AFM. From AFM measurements, we confirmed that our cantilever by DEP allowed us to obtain high resolution images similarly to conventional cantilevers with strong mechanical strength and good stability of scanning.
Keywords
assembling; atomic force microscopy; cantilevers; carbon nanotubes; electrophoresis; mechanical strength; tungsten; AC electric field; AFM measurement; DEP process; SW-CNT bundle bridge; assembly process; atomic force microscopy; cantilever; cantilever tip; dielectrophoresis; frequency 5 MHz; mechanical strength; optical microscope; porous aluminum surface; resolution images; scanning stability; single-walled carbon nanotube integration; tungsten probe; voltage 20 V; Decision support systems;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems (MEMS), 2013 IEEE 26th International Conference on
Conference_Location
Taipei
ISSN
1084-6999
Print_ISBN
978-1-4673-5654-1
Type
conf
DOI
10.1109/MEMSYS.2013.6474242
Filename
6474242
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