Title :
Interconnect and substrate modeling and analysis: an overview
Author_Institution :
IBM Austin Res. Lab., Austin, TX., USA
Abstract :
Accurate models for metal interconnect, silicon substrate and packaging have become necessary for accurate simulation of high-speed designs. An overview of the hierarchy of techniques used to model and simulate these structures is given. While not an exhaustive summary, the purpose of the paper is to give the designer fundamental and practical understanding of principles used in modeling and analysis
Keywords :
circuit analysis computing; digital simulation; integrated circuit design; integrated circuit interconnections; integrated circuit metallisation; integrated circuit modelling; integrated circuit packaging; substrates; high-speed designs; interconnect modeling; metal interconnect; modeling; packaging; simulation techniques hierarchy; substrate modeling; Bonding; Circuit simulation; Coupling circuits; Distributed parameter circuits; Integrated circuit interconnections; Maxwell equations; Packaging; RLC circuits; Semiconductor device modeling; Silicon;
Conference_Titel :
Bipolar/BiCMOS Circuits and Technology Meeting, 1997. Proceedings of the
Conference_Location :
Minneapolis, MN
Print_ISBN :
0-7803-3916-9
DOI :
10.1109/BIPOL.1997.647425
