Title :
Technology for fabricating dense 3-D microstructure arrays for biomimetic hair-like sensors
Author :
Tang, Yuchen ; Peterson, Rebecca L. ; Najafi, Khalil
Author_Institution :
Center for Wireless Integrated MicroSensing & Syst. (WIMS), Univ. of Michigan, Ann Arbor, MI, USA
Abstract :
This paper reports high-density arrays of 3-dimensional (3-D) high-aspect ratio MEMS structures that can imitate biological hairs. Hair has many properties, including high aspect ratio (long and small footprint), large surface area, mechanical flexibility and robustness, and customized material properties. Hair sensors can be made in large arrays, provide high sensitivity through local neural processing, and offer a multiplicity of functions. In nature, hairs typically exist in large-scale arrays, offering distributed sensing functions, redundancy, and improved stability, sensitivity, and dynamic range. In this paper, we present a fabrication technology for forming highly dense 3-D arrays of microstructures useful for a variety of sensing applications, which realize some of these biological advantages. We have fabricated 4×4, 5×5, and 10×10 accelerometer arrays, achieving a sensor density of ~100 sensors/mm2. Initial testing shows accelerometer resonant frequencies and static capacitance values that vary with proof mass and hair/spring dimensions as expected.
Keywords :
accelerometers; biomimetics; microfabrication; microsensors; sensor arrays; 3-dimensional high-aspect ratio MEMS structures; accelerometer arrays; accelerometer resonant frequencies; biomimetic hair-like sensors; customized material properties; dense 3D microstructure array fabrication technology; distributed sensing functions; dynamic range; hair-spring dimensions; high-density 3D arrays; large-scale arrays; local neural processing; mechanical flexibility; mechanical robustness; proof mass; sensitivity improvement; sensor density; stability improvement; static capacitance values; surface area; Glass; Hair; Metals; Sensitivity; Sensor arrays; Silicon;
Conference_Titel :
Micro Electro Mechanical Systems (MEMS), 2013 IEEE 26th International Conference on
Conference_Location :
Taipei
Print_ISBN :
978-1-4673-5654-1
DOI :
10.1109/MEMSYS.2013.6474251