Hetero multilayer structures by rapid prototyping for simultaneous encapsulation and interconnection of microchips

This paper presents a novel use of photopolymerization-based rapid prototyping for simultaneous encapsulation and interconnection of MEMS and μTAS chips. Recent photopolymerization-based rapid prototyping achieves high machining resolution so as to be combined with micromachining. This paper demonstrates combination of rapid prototyped structure and MEMS and μTAS chips such as pressure sensor and fluidic structures of PDMS (polydimethylsiloxane). Supporting material for photopolymerization-based rapid prototyping can be used as sacrificial structures. Sacrificial etching of supporting material allows complicated three dimensional structures by rapid prototyping. Hetero connected channels will be also demonstrated through combination of RP and micromachining.