DocumentCode :
3496220
Title :
Fabrication and packaging process of silicon resonators capable of the integration of LSI for application of timing device
Author :
Nguyen Van Toan ; Miyashita, Hiroaki ; Toda, Masayoshi ; Kawai, Yusuke ; Ono, Takahito
Author_Institution :
Grad. Sch. of Eng., Tohoku Univ., Sendai, Japan
fYear :
2013
fDate :
20-24 Jan. 2013
Firstpage :
377
Lastpage :
380
Abstract :
In this paper, silicon resonators were hermetically packaged on basis of anodic bonding of Si and LTCC (Low Temperature Co-fired ceramic) substrates. This research aims at developing the integration technology of the resonator on LSI (Large Scale Integration) for application of a timing device. The structures of the resonators were transferred onto the LTCC substrate using the anodic bonding of silicon and LTCC for electrical interconnections. Then the resonator structures were packaged hermetically by the second anodic bonding of silicon and Tempax glass for encapsulation. The device can be directly bonded to LSI.
Keywords :
ceramic packaging; elemental semiconductors; encapsulation; hermetic seals; large scale integration; resonators; silicon; LSI integration; LTCC substrate; Tempax glass; anodic bonding; electrical interconnections; encapsulation; fabrication process; hermetic packaging; integration technology; large scale integration; low-temperature co-fired ceramic substrate; packaging process; silicon resonators; silicon substrate; timing device application; Electrostatics; Frequency measurement; Large scale integration; Packaging; Resonant frequency; Silicon; Substrates;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro Electro Mechanical Systems (MEMS), 2013 IEEE 26th International Conference on
Conference_Location :
Taipei
ISSN :
1084-6999
Print_ISBN :
978-1-4673-5654-1
Type :
conf
DOI :
10.1109/MEMSYS.2013.6474257
Filename :
6474257
Link To Document :
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