Fabrication and packaging process of silicon resonators capable of the integration of LSI for application of timing device

Author

Nguyen Van Toan ; Miyashita, Hiroaki ; Toda, Masayoshi ; Kawai, Yusuke ; Ono, Takahito

Author_Institution

Grad. Sch. of Eng., Tohoku Univ., Sendai, Japan

fYear

2013

fDate

20-24 Jan. 2013

Firstpage

377

Lastpage

380

Abstract

In this paper, silicon resonators were hermetically packaged on basis of anodic bonding of Si and LTCC (Low Temperature Co-fired ceramic) substrates. This research aims at developing the integration technology of the resonator on LSI (Large Scale Integration) for application of a timing device. The structures of the resonators were transferred onto the LTCC substrate using the anodic bonding of silicon and LTCC for electrical interconnections. Then the resonator structures were packaged hermetically by the second anodic bonding of silicon and Tempax glass for encapsulation. The device can be directly bonded to LSI.

Keywords

ceramic packaging; elemental semiconductors; encapsulation; hermetic seals; large scale integration; resonators; silicon; LSI integration; LTCC substrate; Tempax glass; anodic bonding; electrical interconnections; encapsulation; fabrication process; hermetic packaging; integration technology; large scale integration; low-temperature co-fired ceramic substrate; packaging process; silicon resonators; silicon substrate; timing device application; Electrostatics; Frequency measurement; Large scale integration; Packaging; Resonant frequency; Silicon; Substrates;

fLanguage

English

Publisher

ieee

Conference_Titel

Micro Electro Mechanical Systems (MEMS), 2013 IEEE 26th International Conference on

Conference_Location

Taipei

ISSN

1084-6999

Print_ISBN

978-1-4673-5654-1

Type

conf

DOI

10.1109/MEMSYS.2013.6474257

Filename

6474257