Fabrication and packaging process of silicon resonators capable of the integration of LSI for application of timing device

In this paper, silicon resonators were hermetically packaged on basis of anodic bonding of Si and LTCC (Low Temperature Co-fired ceramic) substrates. This research aims at developing the integration technology of the resonator on LSI (Large Scale Integration) for application of a timing device. The structures of the resonators were transferred onto the LTCC substrate using the anodic bonding of silicon and LTCC for electrical interconnections. Then the resonator structures were packaged hermetically by the second anodic bonding of silicon and Tempax glass for encapsulation. The device can be directly bonded to LSI.