• DocumentCode
    3496402
  • Title

    A proposed set of specific standard EMC problems to help engineers evaluate EMC modeling tools

  • Author

    Archambeault, Bruce ; Pratapneni, Satish ; Zhang, Lauren ; Wittwer, David C. ; Chen, Juan

  • Author_Institution
    IBM Corp., Research Triangle Park, NC, USA
  • Volume
    2
  • fYear
    2001
  • fDate
    2001
  • Firstpage
    1335
  • Abstract
    As the complexity of high-speed electronic system packages increase, engineers and designers are required to take control of more and more aspects of electrical and mechanical engineering early in the design cycle. In order to achieve the objective of faster time-to-market and to be cost effective one needs to be able to predict the electromagnetic radiated emission noises of the system design by using full-wave simulation tools. Modifications and improvements of the design can be easily tested with simulators to reach the best possible compromise between EMC requirements and cost/thermal/etc considerations. The key contribution of this work is to provide a collection of a set of four standard problems faced by any typical system designer and example solutions from different tools by different users. The proposed standard problems include a power/ground plane decoupling problem, a printed circuit board with a microstrip trace which runs over a split in the ground reference plane, a heatsink emissions problem, and a shielding effectiveness problem. In this paper, each of these problems is described, and an example result provided
  • Keywords
    electrical engineering computing; electromagnetic compatibility; electromagnetic interference; electromagnetic shielding; heat sinks; microstrip lines; printed circuits; EMC modeling tools evaluation; EMI; electrical engineering; electromagnetic radiated emission noises prediction; faster time-to-market; full-wave simulation tools; ground reference plane split; heatsink emissions; high-speed electronic system packages; mechanical engineering; microstrip trace; power/ground plane decoupling; printed circuit board; shielding effectiveness; standard EMC problems; Control systems; Costs; Design engineering; Electromagnetic compatibility; Electromagnetic radiation; Electronics packaging; High-speed electronics; Mechanical engineering; Systems engineering and theory; Time to market;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility, 2001. EMC. 2001 IEEE International Symposium on
  • Conference_Location
    Montreal, Que.
  • Print_ISBN
    0-7803-6569-0
  • Type

    conf

  • DOI
    10.1109/ISEMC.2001.950650
  • Filename
    950650