• DocumentCode
    3496747
  • Title

    Paper-based strain sensing material

  • Author

    Khajeh, E. ; Lou, Wenjing ; Stoeber, Boris

  • Author_Institution
    Univ. of British Columbia, Vancouver, BC, Canada
  • fYear
    2013
  • fDate
    20-24 Jan. 2013
  • Firstpage
    473
  • Lastpage
    476
  • Abstract
    We have developed an inexpensive inkjet printing process to fabricate percolation-based resistive strain gauges in a paper substrate. These strain sensors were fabricated by inkjet printing different suspensions containing conductive carbon black (CB). We have measured the resistance of these elements as a function of strain under low frequency cyclic loads to characterize the sensitivity of these sensing materials. Within the range of parameters investigated, our results suggest that a suspension with 3 wt% CB and 0.1 wt% binder has the highest sensitivity with a gauge factor (GF) of up to 70; however, these materials show a limited reproducibility. Devices printed from other suspensions show a lower gauge factor but can have a much higher reproducibility with a coefficient of variation of their GF below 10%. This makes these inexpensive materials ideal for disposable devices that only need to carry out a few measurements such as load and / or impact force measurement with packing material or destructive testing.
  • Keywords
    carbon; ink jet printing; microfabrication; microsensors; paper; percolation; strain sensors; conductive carbon black; disposable device; inexpensive inkjet printing process; inexpensive material; low frequency cyclic load; paper based strain sensing material; paper substrate; percolation based resistive strain gauge; Electrical resistance measurement; Materials; Micromechanical devices; Resistance; Sensors; Strain; Suspensions;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems (MEMS), 2013 IEEE 26th International Conference on
  • Conference_Location
    Taipei
  • ISSN
    1084-6999
  • Print_ISBN
    978-1-4673-5654-1
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2013.6474281
  • Filename
    6474281