Title :
Robust silicon carbide (SiC) nanoelectromechanical switches with long cycles in ambient and high temperature conditions
Author :
Tina He ; Rui Yang ; Rajgopal, Srihari ; Tupta, Mary Anne ; Bhunia, Swarup ; Mehregany, Mehran ; Feng, Philip X.-L
Author_Institution :
Electr. Eng., Case Western Reserve Univ., Cleveland, OH, USA
Abstract :
We report experimental demonstration of nanoscale electromechanical contact-mode switches with clearly high comparative performance, enabled by polycrystalline silicon carbide (poly-SiC) nanomechanical cantilevers, in a three-terminal, gate-controlled, lateral configuration. We have recorded the complete time evolution of the measured switching events in ambient air, by switching devices on and off for ≥105-106 cycles without failure (i.e., devices still alive; special accelerated tests are needed to properly `exhaust´ the device and approach its intrinsic lifetime). These SiC nanoelectromechanical systems (NEMS) based switches have all dimensions but length in nanometer scale, and demonstrate on/off ratios of ~104 or higher, with repeatable performance over days in air. We have also demonstrated SiC NEMS switches operating at high temperature (T≈500°C) in air. With a typical motional volume of only ~1μm3 and long `hot´ switching cycles in air, these SiC devices exhibit strong potential toward realizing robust NEMS switches and logic circuits.
Keywords :
cantilevers; logic circuits; nanoelectromechanical devices; silicon compounds; switches; wide band gap semiconductors; SiC; ambient temperature condition; high-temperature condition; hot-switching cycles; logic circuits; nanoscale electromechanical contact-mode switches; on-off ratios; polycrystalline silicon carbide nanomechanical cantilevers; robust silicon carbide nanoelectromechanical switches; silicon carbide NEMS switches; temperature 500 degC; three-terminal gate-controlled lateral configuration; Current measurement; Hysteresis; Logic gates; Nanoelectromechanical systems; Silicon carbide; Switches; Voltage measurement;
Conference_Titel :
Micro Electro Mechanical Systems (MEMS), 2013 IEEE 26th International Conference on
Conference_Location :
Taipei
Print_ISBN :
978-1-4673-5654-1
DOI :
10.1109/MEMSYS.2013.6474292