• DocumentCode
    3497174
  • Title

    Low-power Networks-on-Chip: Progress and remaining challenges

  • Author

    Buckler, Mark ; Burleson, Wayne ; Sadowski, Greg

  • Author_Institution
    AMD Res., Boxborough, MA, USA
  • fYear
    2013
  • fDate
    4-6 Sept. 2013
  • Firstpage
    132
  • Lastpage
    134
  • Abstract
    After a long period of academic and industrial research, networks-on-chips (NoCs) are starting to be incorporated into commercial multi-processor designs. NoCs have proven themselves to scale better than bus-based designs and they are here to stay. It is still important to note, however, that even well-designed NoCs consume a large portion of a given system´s power budget. This brief paper and accompanying presentation discuss what options are available to designers who need to reduce NoC power consumption, their benefits, and their limitations. Techniques discussed here include general NoC system design as well as disruptive interconnect mediums and their associated strategies.
  • Keywords
    integrated circuit design; integrated circuit interconnections; network-on-chip; bus-based designs; commercial multiprocessor designs; disruptive interconnect mediums; general NoC system design; low-power networks-on-chip; power budget; Integrated circuit interconnections; Nanophotonics; Network-on-chip; Three-dimensional displays; Wireless communication; 3D; Asynchronous; Cache Coherence; DVFS; Low Power; Low Swing; Nanophotonics; Networks-on-Chip; Wireless;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Low Power Electronics and Design (ISLPED), 2013 IEEE International Symposium on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4799-1234-6
  • Type

    conf

  • DOI
    10.1109/ISLPED.2013.6629279
  • Filename
    6629279