• DocumentCode
    3497815
  • Title

    High reliability metal insulator metal capacitors for silicon germanium analog applications

  • Author

    Stein, Ken ; Kocis, Joe ; Hueckel, Gary ; Eld, Ernie ; Bartush, Tom ; Groves, Rob ; Greco, Nancy ; Harame, Dave ; Tewksbury, Ted

  • Author_Institution
    IBM Corp., Hopewell Junction, NY, USA
  • fYear
    1997
  • fDate
    28-30 Sep 1997
  • Firstpage
    191
  • Lastpage
    194
  • Abstract
    In this work, a novel “planar” metal-insulator-metal capacitor (MIMCAP) process is introduced, integrated in a Silicon Germanium (SiGe) HBT process, which has excellent yield, reliability and repeatability. The MIMCAP was characterized for DC and AC parametrics, and stressed at elevated biases and temperatures to assess reliability. An equivalent circuit and SPICE model were generated, and good agreement was found between the simulated and measured characteristics. A MIMCAP with high device/bottom plate capacitance ratio, excellent yield and reliability are critical needs in high quality passives for the fabrication of advanced analog mixed/signal circuits with on-chip components. In collaboration with Analog Devices, SiGe HBT voltage controlled oscillators (VCO) circuits were designed with both MIMCAP and substrate capacitor controls to demonstrate the leverage of this novel passive element
  • Keywords
    Ge-Si alloys; MIM devices; analogue integrated circuits; capacitors; equivalent circuits; mixed analogue-digital integrated circuits; reliability; HBT VCO circuits; SPICE model; SiGe; SiGe HBT process; analog mixed/signal circuits; equivalent circuit; high reliability MIM capacitors; metal-insulator-metal capacitors; planar MIMCAP process; voltage controlled oscillators; Germanium silicon alloys; Heterojunction bipolar transistors; Insulation; Integrated circuit reliability; Integrated circuit yield; MIM capacitors; Metal-insulator structures; Silicon germanium; Temperature; Voltage-controlled oscillators;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Bipolar/BiCMOS Circuits and Technology Meeting, 1997. Proceedings of the
  • Conference_Location
    Minneapolis, MN
  • ISSN
    1088-9299
  • Print_ISBN
    0-7803-3916-9
  • Type

    conf

  • DOI
    10.1109/BIPOL.1997.647433
  • Filename
    647433