• DocumentCode
    3498019
  • Title

    A microplasma chip for VUV light source

  • Author

    Sato, Ryota ; Yasumatsu, Daisuke ; Kumagai, Shinya ; Hori, Muneo ; Sasaki, Motoharu

  • Author_Institution
    Toyota Technol. Inst., Nagoya, Japan
  • fYear
    2013
  • fDate
    20-24 Jan. 2013
  • Firstpage
    705
  • Lastpage
    708
  • Abstract
    An atmospheric pressure microplasma source was fabricated for a vacuum ultra violet (VUV) light source used in spectrometric plasma diagnosis. A quartz capillary tube (O.D.:Φ1.5mm, I.D.: Φ1mm) was set in a spiral coil. A floating wire was set inside the tube to assist ignition. Under the He gas flow (0.5slm), the fabricated microplasma source achieved easy plasma ignition under the ambient conditions. The microplasma was confined in the tube (Φ1mm). VUV emissions of N, O, and H atoms were obtained at the VHF power of 10W. The microplasma source was further miniaturized by MEMS technology towards a transportable device. Size of the fabricated microplasma chip size was 20mm × 3 mm. Generation of Φ200μm-diam.-microplasma in the chip was achieved at the VHF power of 45 W.
  • Keywords
    atmospheric pressure; coils; helium; ignition; light sources; microfabrication; micromechanical devices; plasma devices; plasma diagnostics; plasma flow; plasma sources; plasma transport processes; He; MEMS technology; VHF power; VUV emissions; VUV light source; atmospheric pressure microplasma source fabricated; floating wire; gas flow; microplasma chip; microplasma chip size; microplasma source; plasma ignition; power 10 W; power 45 W; pressure 1 atm; quartz capillary tube; size 1 mm; size 1.5 mm; size 200 mum; spectrometric plasma diagnosis; spiral coil; transportable device; vacuum ultra violet light source; Atmospheric measurements; Discharges (electric); Electrodes; Electron tubes; Ignition; Plasmas; Resists;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems (MEMS), 2013 IEEE 26th International Conference on
  • Conference_Location
    Taipei
  • ISSN
    1084-6999
  • Print_ISBN
    978-1-4673-5654-1
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2013.6474340
  • Filename
    6474340