DocumentCode :
3498186
Title :
Piezoelectric properties of ScAlN thin films for piezo-MEMS devices
Author :
Umeda, Kazunori ; Kawai, Hiroyuki ; Honda, A. ; Akiyama, Masanori ; Kato, Toshihiko ; Fukura, T.
Author_Institution :
Murata Manuf. Co., Ltd., Japan
fYear :
2013
fDate :
20-24 Jan. 2013
Firstpage :
733
Lastpage :
736
Abstract :
This paper reports the piezoelectric properties of ScAlN thin films. We evaluated the piezoelectric coefficients d33 and d31 of ScxAl1-xN thin films directly deposited onto silicon wafers, as well the radio frequency (RF) electrical characteristics of Sc0.35Al0.65N bulk acoustic wave (BAW) resonators at around 2 GHz, and found a maximum value for d33 of 28 pC/N and a maximum -d31 of 13 pm/V at 40% scandium concentration. In BAW resonators that use Sc0.35Al0.65N as a piezoelectric film, the electromechanical coupling coefficient k2 (=15.5%) was found to be 2.6 times that of resonators with AlN films. These experimental results are in very close agreement with first-principles calculations. The large electromechanical coupling coefficient and high sound velocity of these films should make them suitable for high frequency applications.
Keywords :
ab initio calculations; acoustic resonators; bulk acoustic wave devices; elemental semiconductors; microfabrication; micromechanical devices; piezoelectric devices; piezoelectric thin films; piezoelectricity; scandium compounds; silicon; thin film devices; BAW; RF electrical characteristics; Sc0.35Al0.65N-Si; bulk acoustic wave resonator; electromechanical coupling coefficient; first-principles calculation; microfabrication; piezoMEMS device; piezoelectric coefficient evaluation; piezoelectric property; piezoelectric thin film; radiofrequency electrical characteristics; scandium concentration; silicon wafer deposition; Electrodes; Films; Frequency measurement; Resonant frequency; Sputtering; Substrates; Temperature measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro Electro Mechanical Systems (MEMS), 2013 IEEE 26th International Conference on
Conference_Location :
Taipei
ISSN :
1084-6999
Print_ISBN :
978-1-4673-5654-1
Type :
conf
DOI :
10.1109/MEMSYS.2013.6474347
Filename :
6474347
Link To Document :
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