DocumentCode
3498369
Title
Energy characterization and instruction-level energy model of Intel´s Xeon Phi processor
Author
Shao, Yakun Sophia ; Brooks, David
Author_Institution
Harvard Univ., Cambridge, MA, USA
fYear
2013
fDate
4-6 Sept. 2013
Firstpage
389
Lastpage
394
Abstract
Intel´s Xeon Phi is the first commercial many-core/multi-thread ×86-based processor. Xeon Phi belongs to a new breed of high performance computing processors that seek high compute density as well as energy efficiency. However, no highlevel energy model is available for Xeon Phi software developers to quickly evaluate and optimize energy efficiency. This work demonstrates an instruction-level energy model for the Xeon Phi processor to facilitate the development of energy-efficient software. In order to construct this model, we first characterize the energy consumption of the processor, identifying how energy per instruction scales with the number of cores, the number of active threads per core, and instruction types. Based on the energy characterization, we construct an instruction-level energy model and validate the accuracy of the model between 1% and 5% for real world benchmarks. We show that the energy model can be used to identify software inefficiencies for these benchmarks and find that Linpack code can be optimized to increase energy efficiency by as much as 10%.
Keywords
benchmark testing; energy consumption; microprocessor chips; multi-threading; multiprocessing systems; power aware computing; Intel Xeon Phi processor; Linpack code; Xeon Phi software developers; commercial manycore multithread x86-based processor; energy characterization; energy efficiency; energy-efficient software; high performance computing processors; high-level energy model; instruction-level energy model; processor energy consumption; Bandwidth; Computational modeling; Prefetching; Radiation detectors; Vectors; Energy Characterization; Instruction-Level Energy Model; Xeon Phi;
fLanguage
English
Publisher
ieee
Conference_Titel
Low Power Electronics and Design (ISLPED), 2013 IEEE International Symposium on
Conference_Location
Beijing
Print_ISBN
978-1-4799-1234-6
Type
conf
DOI
10.1109/ISLPED.2013.6629328
Filename
6629328
Link To Document