Title :
Deep Trench NPN Transistor for Low-RON ESD Protection of High-Voltage I/Os in Advanced Smart Power Technology
Author :
Gendron, A. ; Salamero, C. ; Nolhier, N. ; Bafleur, M. ; Renaud, P. ; Besse, P.
Author_Institution :
Freescale Semicond., Toulouse Cedex
Abstract :
An innovative self-biased NPN transistor dedicated to the ESD protection of high voltage I/Os is presented. To fulfil a high clamping voltage / low on-state resistance specification, the authors have taken benefit of specific technology features, as deep insulation trenches, low-doped epitaxy and high-doped buried layer. First, the guidelines allowing the increase of the clamping voltage and the lowering of the on-state resistance are defined, based on an accurate description of the physical mechanisms involved during an ESD stress. Then, the proposed NPN transistor is described, and the results of measurements and TCAD simulations are presented. Excellent capabilities as 40 Volt clamping voltage, zero on-state resistance and It2 higher than 5 Ampere have been achieved
Keywords :
bipolar integrated circuits; buried layers; electrostatic discharge; isolation technology; power bipolar transistors; power integrated circuits; technology CAD (electronics); 40 V; ESD protection; TCAD simulations; advanced smart power technology; deep insulation trenches; deep trench NPN transistor; high-doped buried layer; high-voltage I/O; low-doped epitaxy; self-biased NPN transistor; Clamps; Electrical resistance measurement; Electrostatic discharge; Epitaxial growth; Guidelines; Insulation; Low voltage; Protection; Stress; Transistors;
Conference_Titel :
Bipolar/BiCMOS Circuits and Technology Meeting, 2006
Conference_Location :
Maastricht
Print_ISBN :
1-4244-0458-4
Electronic_ISBN :
1088-9299
DOI :
10.1109/BIPOL.2006.311138