Substrate Transfer: an Enabling Technology for System-in-Package Solutions

A simple and robust technology for the transfer of circuits, processed on normal silicon wafers, to alternative substrates is presented. Substrate transfer technology (STT) is a post-processing technology based on adhesive bonding using a UV curing adhesive. The authors demonstrate that STT can be used for the elimination of RF substrate losses, for double sided device processing and for the fabrication of flexible circuits and thermal sensors and actuators. The successful industrialization of the process demonstrates that STT is indeed a viable option for high-yield, low-cost mass production