• DocumentCode
    3499717
  • Title

    Design considerations for high-density high-speed bipolar ROM

  • Author

    Pong-Fei Lu ; Shin, Hyun J. ; Chuang, Ching-Te ; Arienzo, M.

  • Author_Institution
    IBM Res. Div., T.J. Watson Res. Center, Yorktown Heights, NY, USA
  • fYear
    1993
  • fDate
    1993
  • Firstpage
    339
  • Lastpage
    342
  • Abstract
    This paper presents a high-density high-speed cross-point bipolar ROM (XROM) design for control store applications. The cross-point architecture reduces the cell size up to 35% by sharing the word-line base contact in a silicided-base technology. Circuit simulations show that the performance impact due to the series base silicide resistance is insignificant. Data-dependent access-time skew inherent to the conventional bipolar ROM circuit is discussed, and an active pull-down bit-line discharge circuit technique to reduce the skew is described. The density and performance potential of the XROM in a 0.5 mu m bipolar technology are assessed.
  • Keywords
    bipolar integrated circuits; integrated memory circuits; memory architecture; read-only storage; 0.5 micron; XROM design; active pull-down bit-line discharge circuit technique; bipolar technology; cross-point architecture; data dependent access time; high-speed cross-point bipolar ROM; series base silicide resistance; silicided-base technology; word-line base contact; Bipolar transistor circuits; Circuit simulation; Computer architecture; Delay; Logic; Read only memory; Silicides; Switches; Switching circuits; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Technology, Systems, and Applications, 1993. Proceedings of Technical Papers. 1993 International Symposium on
  • Conference_Location
    Taipei, Taiwan
  • ISSN
    1524-766X
  • Print_ISBN
    0-7803-0978-2
  • Type

    conf

  • DOI
    10.1109/VTSA.1993.263676
  • Filename
    263676