DocumentCode
3499717
Title
Design considerations for high-density high-speed bipolar ROM
Author
Pong-Fei Lu ; Shin, Hyun J. ; Chuang, Ching-Te ; Arienzo, M.
Author_Institution
IBM Res. Div., T.J. Watson Res. Center, Yorktown Heights, NY, USA
fYear
1993
fDate
1993
Firstpage
339
Lastpage
342
Abstract
This paper presents a high-density high-speed cross-point bipolar ROM (XROM) design for control store applications. The cross-point architecture reduces the cell size up to 35% by sharing the word-line base contact in a silicided-base technology. Circuit simulations show that the performance impact due to the series base silicide resistance is insignificant. Data-dependent access-time skew inherent to the conventional bipolar ROM circuit is discussed, and an active pull-down bit-line discharge circuit technique to reduce the skew is described. The density and performance potential of the XROM in a 0.5 mu m bipolar technology are assessed.
Keywords
bipolar integrated circuits; integrated memory circuits; memory architecture; read-only storage; 0.5 micron; XROM design; active pull-down bit-line discharge circuit technique; bipolar technology; cross-point architecture; data dependent access time; high-speed cross-point bipolar ROM; series base silicide resistance; silicided-base technology; word-line base contact; Bipolar transistor circuits; Circuit simulation; Computer architecture; Delay; Logic; Read only memory; Silicides; Switches; Switching circuits; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Technology, Systems, and Applications, 1993. Proceedings of Technical Papers. 1993 International Symposium on
Conference_Location
Taipei, Taiwan
ISSN
1524-766X
Print_ISBN
0-7803-0978-2
Type
conf
DOI
10.1109/VTSA.1993.263676
Filename
263676
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