• DocumentCode
    3499815
  • Title

    High-sensitivity erectrochemical sensor using pyrolyzed polymer-gold 3D probe arrays for spatial chemical sensing

  • Author

    Tonomura, W. ; Mori, Yojiro ; Konishi, Satoshi

  • Author_Institution
    Ritsumeikan Univ., Kusatsu, Japan
  • fYear
    2013
  • fDate
    20-24 Jan. 2013
  • Firstpage
    1011
  • Lastpage
    1014
  • Abstract
    This paper reports spatially arranged pyrolyzed polymer-gold probes to allow high-sensitivity monitoring of spatially distributed chemicals. Pyrolyzed polymer is a promising carbon material for applications of electrochemical sensors. Out-of-plane gold microelectrodes coated by polymer film (parylene-C) are transformed to conductive carbon-gold materials by annealing at 1000°C for 2h in a vacuum chamber. 3D probe technology using wire bonding makes it possible to provide the spatially arranged microelectrodes. This paper demonstrates pyrolyzed polymer-gold 3D probes have high sensitivity and wider electrochemical potential window than typical electrochemical electrode materials such as gold to realize spatial chemical sensing.
  • Keywords
    annealing; electrochemical electrodes; electrochemical sensors; gold; lead bonding; microelectrodes; polymers; pyrolysis; 3D probe technology; annealing; carbon material; conductive carbon-gold materials; electrochemical electrode materials; electrochemical potential window; high-sensitivity electrochemical sensor; high-sensitivity monitoring; out-of-plane gold microelectrodes; parylene-C; polymer film coating; pyrolyzed polymer-gold 3D probe arrays; spatial chemical sensing; spatially-arranged microelectrodes; spatially-arranged pyrolyzed polymer-gold probes; spatially-distributed chemicals; temperature 1000 degC; time 2 h; vacuum chamber; wire bonding; Carbon; Chemicals; Electrodes; Gold; Polymers; Probes;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems (MEMS), 2013 IEEE 26th International Conference on
  • Conference_Location
    Taipei
  • ISSN
    1084-6999
  • Print_ISBN
    978-1-4673-5654-1
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2013.6474419
  • Filename
    6474419