• DocumentCode
    3500141
  • Title

    Key factors in designing a manufacturing line to maximize tool utilization and minimize turnaround time

  • Author

    Martin, Donald P.

  • Author_Institution
    IBM Technol. Products, Essex Junction, VT, USA
  • fYear
    1993
  • fDate
    1993
  • Firstpage
    48
  • Lastpage
    53
  • Abstract
    Today´s semiconductor manufacturing facilities require very expensive tools, with the total investment necessary to equip a production line approaching a half-billion dollars. Therefore, it is imperative to understand those factors that help to determine the number of tools to be purchased, their characteristics, and how they should be arranged to attain the most effective utilization of these assets. This paper shows that the imposition of a turnaround-time (TAT) requirement on a tool set/manufacturing line introduces additional constraints on tool operating characteristics. Tool availability, the time a tool is off line, and the number of tools per process now become key factors that must be used to determine the effective capacity and achievable turnaround time of a tool set/manufacturing line. The results of this work show how tool design and installation characteristics can significantly improve line capacity and reduce TAT. Some fundamental elements of designing a manufacturing line are also discussed, such as when tools should be arranged in a ´farmed´ mode (in close proximity because of process similarity and their independence from process flow) or a ´linear´ mode, (with dissimilar tools/processes arranged in close proximity because of process-flow sequence).
  • Keywords
    production control; queueing theory; semiconductor device manufacture; effective capacity; farmed mode; line capacity; linear mode; manufacturing line; semiconductor manufacturing facilities; tool operating characteristics; tool utilization; turnaround time; Costs; Investments; Manufacturing processes; Production facilities; Productivity; Queueing analysis; Semiconductor device manufacture;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Manufacturing Science Symposium, 1993. ISMSS 1993., IEEE/SEMI International
  • Conference_Location
    San Francisco, CA, USA
  • Print_ISBN
    0-7803-1212-0
  • Type

    conf

  • DOI
    10.1109/ISMSS.1993.263701
  • Filename
    263701