• DocumentCode
    3500236
  • Title

    In situ particle monitoring in a single wafer poly silicon and silicon nitride etch system

  • Author

    Busselman, B. ; Emery, T. ; Staker, K. ; Heiman, K. ; Tran, D. ; Elzingre, M. ; Markle, R.

  • Author_Institution
    Texas Instrum., SEMATECH, Dallas, TX, USA
  • fYear
    1993
  • fDate
    1993
  • Firstpage
    20
  • Lastpage
    26
  • Abstract
    An in situ particle monitor has been installed in a single wafer polysilicon and silicon nitride etch system. Particle data collected during etching and wafer transport operations has been correlated to functional yield, short loop monitors and patterned wafer visual inspections. Based on these correlations, significant cost reductions are predicted.
  • Keywords
    etching; particle counting; semiconductor technology; cost reductions; etch system; functional yield; in situ particle monitor; nitride etching; patterned wafer visual inspections; polysilicon etching; short loop monitors; single wafer; wafer transport operations; Costs; Etching; Inspection; Instruments; Manufacturing processes; Monitoring; Particle production; Plasma applications; Semiconductor device manufacture; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Manufacturing Science Symposium, 1993. ISMSS 1993., IEEE/SEMI International
  • Conference_Location
    San Francisco, CA, USA
  • Print_ISBN
    0-7803-1212-0
  • Type

    conf

  • DOI
    10.1109/ISMSS.1993.263705
  • Filename
    263705