DocumentCode :
3500761
Title :
Placement of substrate contacts to alleviate substrate noise in epi and non-epi technologies
Author :
Secareanu, Radu M. ; Warner, Scott ; Seabridge, Scott ; Burke, Cathie ; Watrobski, Thomas E. ; Morton, Christopher ; Staub, William ; Tellier, Thomas ; Friedman, Eby G.
Author_Institution :
Dept. of Electr. Eng. & Comput. Eng., Rochester Univ., NY, USA
Volume :
3
fYear :
2000
fDate :
2000
Firstpage :
1314
Abstract :
The placement of substrate contacts in epi and non-epi technologies in order to control and reduce the substrate noise amplitude and spreading is analyzed. The choice of small or large substrate contacts or rings for each of the two major technologies are highlighted. Design guidelines for placing substrate contacts particularly appropriate to improving the noise immunity of digital circuits in mixed-signal smart-power systems are also presented
Keywords :
integrated circuit design; integrated circuit noise; mixed analogue-digital integrated circuits; power integrated circuits; design guidelines; digital circuits; epi technologies; mixed-signal smart-power systems; noise amplitude; noise immunity; nonepi technologies; spreading; substrate contacts placement; substrate noise; Character generation; Circuit noise; Contacts; Digital circuits; Noise generators; Noise level; Power generation; Semiconductor device noise; Substrates; Working environment noise;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Circuits and Systems, 2000. Proceedings of the 43rd IEEE Midwest Symposium on
Conference_Location :
Lansing, MI
Print_ISBN :
0-7803-6475-9
Type :
conf
DOI :
10.1109/MWSCAS.2000.951457
Filename :
951457
Link To Document :
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