Placement of substrate contacts to alleviate substrate noise in epi and non-epi technologies

Author

Secareanu, Radu M. ; Warner, Scott ; Seabridge, Scott ; Burke, Cathie ; Watrobski, Thomas E. ; Morton, Christopher ; Staub, William ; Tellier, Thomas ; Friedman, Eby G.

Author_Institution

Dept. of Electr. Eng. & Comput. Eng., Rochester Univ., NY, USA

Volume

3

fYear

2000

fDate

2000

Firstpage

1314

Abstract

The placement of substrate contacts in epi and non-epi technologies in order to control and reduce the substrate noise amplitude and spreading is analyzed. The choice of small or large substrate contacts or rings for each of the two major technologies are highlighted. Design guidelines for placing substrate contacts particularly appropriate to improving the noise immunity of digital circuits in mixed-signal smart-power systems are also presented

Keywords

integrated circuit design; integrated circuit noise; mixed analogue-digital integrated circuits; power integrated circuits; design guidelines; digital circuits; epi technologies; mixed-signal smart-power systems; noise amplitude; noise immunity; nonepi technologies; spreading; substrate contacts placement; substrate noise; Character generation; Circuit noise; Contacts; Digital circuits; Noise generators; Noise level; Power generation; Semiconductor device noise; Substrates; Working environment noise;

fLanguage

English

Publisher

ieee

Conference_Titel

Circuits and Systems, 2000. Proceedings of the 43rd IEEE Midwest Symposium on

Conference_Location

Lansing, MI

Print_ISBN

0-7803-6475-9

Type

conf

DOI

10.1109/MWSCAS.2000.951457

Filename

951457