• DocumentCode
    350084
  • Title

    Investigation on the analysis software for switching characteristics of large capacity GTO

  • Author

    Qingmin, Li ; Yulong, Huang ; Guozheng, Xu ; Jiali, Qian ; Azuma, Satoshi ; Kimata, Masahiro ; Seto, Makoto

  • Author_Institution
    Dept. of Electr. Eng., Tsinghua Univ., Beijing, China
  • Volume
    2
  • fYear
    1999
  • fDate
    1999
  • Firstpage
    646
  • Abstract
    Owing to the lack of sufficient power loss data of different working conditions for GTO in the technical manuals of many companies, the manufactures and the consumers often encounter difficulties in selecting suitable devices for the design of practicable application systems. The authors have constructed a large capacity test circuit to carry out experimental investigation on the loss characteristics of GTO under various arrangements of circuit parameters. Then the powerful ANN (artificial neural network) and the BP (backpropagation) algorithm are introduced to build up the quantitative relations between the varied circuit parameters and the recorded loss data so that power loss tables can be created. In addition, the paper poses a revised steepest algorithm to fit the high-order heat transfer model of GTO according to its transient thermal behavior. All the algorithms are integrated in a software package based on which to carry through power loss analysis and output the transient and average junction temperature data or curves
  • Keywords
    electronic engineering computing; power engineering computing; power semiconductor switches; semiconductor device models; thermal analysis; thyristors; analysis software; artificial neural network; backpropagation algorithm; circuit parameters; computer simulation; high-order heat transfer model; junction temperature data; large-capacity GTO; power loss analysis; software package; steepest algorithm; switching characteristics; transient thermal behavior; Application software; Artificial neural networks; Backpropagation algorithms; Circuit testing; Employee welfare; Heat transfer; Manuals; Manufacturing; Software algorithms; Software packages;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industrial Electronics Society, 1999. IECON '99 Proceedings. The 25th Annual Conference of the IEEE
  • Conference_Location
    San Jose, CA
  • Print_ISBN
    0-7803-5735-3
  • Type

    conf

  • DOI
    10.1109/IECON.1999.816472
  • Filename
    816472