A study of novel wafer level LED package based on TSV technology

LED (light-emitting diode) has many advantages over traditional lighting source such as higher electrical efficiency, faster response, and free of hazardous, which has been attracting more and more interesting from all of world. LED technology has achieved remarkable progress during latest years already. However, high price is still the main block for its wide application. WLP (wafer level package) is an as-know low cost packaging method, which has been demonstrated in IC (integrated circuit) industry already. Wafer level package for LED is expected as a promising solution for reduction of total LED price. Aimed at low package cost, as well as good thermal and electrical performance, a novel wafer level LED package with TSV (through silicon via) interconnection and remote phosphor was studied. And structure of the packaged LED was characterized, and light performance was tested according to standard LED testing method.