Title :
A study of novel wafer level LED package based on TSV technology
Author :
Dong Chen ; Li Zhang ; Ye Xie ; Tan, K.H. ; Lai, C.M.
Author_Institution :
Jiangyin Changdian Adv. Packaging Co., Ltd., Jiangyin, China
Abstract :
LED (light-emitting diode) has many advantages over traditional lighting source such as higher electrical efficiency, faster response, and free of hazardous, which has been attracting more and more interesting from all of world. LED technology has achieved remarkable progress during latest years already. However, high price is still the main block for its wide application. WLP (wafer level package) is an as-know low cost packaging method, which has been demonstrated in IC (integrated circuit) industry already. Wafer level package for LED is expected as a promising solution for reduction of total LED price. Aimed at low package cost, as well as good thermal and electrical performance, a novel wafer level LED package with TSV (through silicon via) interconnection and remote phosphor was studied. And structure of the packaged LED was characterized, and light performance was tested according to standard LED testing method.
Keywords :
integrated circuit interconnections; integrated circuit testing; light emitting diodes; phosphors; three-dimensional integrated circuits; wafer level packaging; IC industry; TSV interconnection; TSV technology; WLP; electrical efficiency; integrated circuit industry; light-emitting diode; remote phosphor; standard LED testing method; wafer level LED package; Heat transfer; Light emitting diodes; Packaging; Phosphors; Silicon; Through-silicon vias; Wafer scale integration; LED package; Wafer level; remote phosphor; through silicon via;
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on
Conference_Location :
Guilin
Print_ISBN :
978-1-4673-1682-8
Electronic_ISBN :
978-1-4673-1680-4
DOI :
10.1109/ICEPT-HDP.2012.6474567
