• DocumentCode
    3501368
  • Title

    Voltage driving or current driving: Which is preferred for RRAM programming?

  • Author

    Lv, Hangbing ; Lian, Wentai ; Long, Shibing ; Liu, Qi ; Li, Yingtao ; Wang, Wei ; Wang, Yan ; Zhang, Sen ; Liu, Ming

  • Author_Institution
    Lab. of Nano-Fabrication & Novel Devices Integrated Technol., Chinese Acad. of Sci., Beijing, China
  • fYear
    2011
  • fDate
    25-27 April 2011
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    Voltage driving is a commonly used method to program the resistive switching memory. However, a question of whether voltage driving or current driving is preferred has never been answered. For periphery circuit design, one should first consider which kind of source should be adopted. In this work, we systematically evaluated the performance of Cu/HfO2/Pt memory device by using current sweeping or voltage sweeping to SET and RESET. The results show that, tight distribution of Roff and Vset can be achieved by using current driving to RESET, with effectively eliminating the intermediate resistance states. The possible reason for this improvement may arise from a positive-feedback of joule heat generation during RESET process. Besides, uniform Ron distribution can also be realized by current driving, due to more localized conductive filaments formation. The results demonstrate that the current driving method is an effective way to solve the uniformity issue of RRAM.
  • Keywords
    copper compounds; electric resistance; hafnium compounds; integrated circuit design; platinum compounds; random-access storage; Cu-HfO2-Pt; Joule heat generation; RRAM programming; current driving; current sweeping; intermediate resistance state; localized conductive filaments formation; memory device; periphery circuit design; reset process; resistive switching memory; voltage driving; voltage sweeping; Copper; Electrodes; Heating; Power generation; Programming; Resistance; Switches;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Technology, Systems and Applications (VLSI-TSA), 2011 International Symposium on
  • Conference_Location
    Hsinchu
  • ISSN
    1524-766X
  • Print_ISBN
    978-1-4244-8493-5
  • Type

    conf

  • DOI
    10.1109/VTSA.2011.5872248
  • Filename
    5872248