• DocumentCode
    3501433
  • Title

    Enhancement of signal integrity and power integrity with embedded capacitors in high-speed packages

  • Author

    Srinivasan, K. ; Muthana, P. ; Mandrekar, R. ; Engin, E. ; Choi, J. ; Swaminathan, M.

  • Author_Institution
    Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA
  • fYear
    2006
  • fDate
    27-29 March 2006
  • Lastpage
    291
  • Abstract
    Improvements in electrical performance of microelectronic systems can be achieved by the integration of passive elements such as capacitors, resistors and inductors. The advantage of embedded passives is their low parasitic values. In this paper, enhancement of signal-integrity and power-integrity is investigated when a high-k planar capacitor is used as a power-ground plane, with embedded high-k discrete capacitors that have low ESI and ESR values as decoupling capacitors for SSN suppression. In order to capture the effects of embedded capacitor performance, a test-structure involving many signal-lines referenced to a power-ground plane was simulated. Simulation results show that the high-k planar capacitor reduces coupling of noise currents through the power-ground planes and helps improve the eye-opening. Simulation results have been quantified for a case, where a fewer number of embedded discrete capacitors helps reduce SSN more significantly than surface-mounts. Transient co-simulation of the signal delivery network (SDN) and the power-delivery network (PDN) are performed using Y-parameters
  • Keywords
    capacitors; dielectric materials; integrated circuit design; integrated circuit packaging; SSN suppression; Y-parameters; decoupling capacitors; discrete capacitors; electrical performance; embedded capacitors; embedded passives; high-k planar capacitor; high-speed packages; power integrity; power-delivery network; power-ground plane; signal delivery network; signal integrity; transient co-simulation; Capacitors; High K dielectric materials; High-K gate dielectrics; Inductors; Microelectronics; Noise reduction; Packaging; Paramagnetic resonance; Resistors; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Quality Electronic Design, 2006. ISQED '06. 7th International Symposium on
  • Conference_Location
    San Jose, CA
  • Print_ISBN
    0-7695-2523-7
  • Type

    conf

  • DOI
    10.1109/ISQED.2006.60
  • Filename
    1613150