Optical vertical interconnect and integration based on Silicon carrier

This paper focuses on the research of optical vertical interconnect. To achieve optical vertical interconnect a new method for fiber plugging is introduced which also can be used for metal plugging. Because the pitch of both light spot of VCSEL array and sensitive surface of PD array is 250 um, and the pad pitch of VCSEL array and PD array are also 250um. So the pitch of V-Shape Groove or U -Shape Groove on silicon substrate is designed at 250um as a fixture for fiber or metal plugs. Many rows and columns of V-Shape Groove or U -Shape Groove can be stacked as a whole to finish metal wire or fiber plug and vertical distance of adjacent substrate is flexible according to application demand. After the fibers filled in the holes of a silicon interposer, the fiber is surrounded which is thermo curing material. The silicon interposer includes electrical transmission line and optical though silicon via (OTSV). VCSEL and PD assembled on Silicon carrier make up an optical block. Optical performance and microwave interconnect are discussed.