Title :
A study of characteristics of halogen-free prevented solder materials
Author :
Mu-Chun Wang ; Tien-Tsorng Shih ; Bao-Yi Lin ; Hsin-Chia Yang ; Yaw-Dong Wu ; Chuan-Hsi Liu
Author_Institution :
Dept. of Electron. Eng., Minghsin Univ. of Sci. & Technol., Hsinchu, Taiwan
Abstract :
Green electronic products are more preferred in the recent era, especially in lead-free and halogen-free manufactures. A brand-new halogen-free solder resist, AUS320, provides the good performance, compared with the popular low-halogen AUS308 such as in halogen concentration, flatness on cavity surface and roughness on cross-section as well as the optical and thermal reactions.
Keywords :
electronic products; environmental factors; resists; solders; thermal management (packaging); AUS320; cavity surface flatness; cross-section roughness; green electronic product; halogen concentration; halogen-free manufactures; halogen-free prevented solder material; halogen-free solder resist; lead-free manufactures; low-halogen AUS308; optical reaction; thermal reaction; Abstracts; Gold; Materials; Packaging; Reliability; Semiconductor device measurement;
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on
Conference_Location :
Guilin
Print_ISBN :
978-1-4673-1682-8
Electronic_ISBN :
978-1-4673-1680-4
DOI :
10.1109/ICEPT-HDP.2012.6474579
