DocumentCode :
3501635
Title :
Research on microsystem interposer designer software with through silicon via
Author :
Yanzhu Lv ; Min Miao ; Xiaofei Wang ; Huifen Liu ; Xin Sun ; Zhensong Li ; Yuexia Zhang ; Xiaoqing Zhang
Author_Institution :
Inf. Microsyst. Inst., Beijing Inf. Sci. & Technol. Univ., Beijing, China
fYear :
2012
fDate :
13-16 Aug. 2012
Firstpage :
137
Lastpage :
141
Abstract :
This paper introduces the research and development of Interposer Designer© software for microsystem interposer designing. First, An algorithm that screen coordinate is converted to OpenGL coordinate is presented. The algorithm allows the user to draw cube, cylinder, hollow cube, hollow cylinder and other basic graphics elements for Si Interposer with the mouse, handling them in any position of the space. The development platform of Interposer Designer is Microsoft Visual C++6.0 and OpenGL. Designers can draw 2D or 3D interposer model through two ways, basic graphics operation or inputting interposer model parameters. Then, the function of software to extract the equivalent circuit model of the interposer model and output the RLC parameters are explained. The software may give output in .csv format.
Keywords :
C++ language; RLC circuits; Visual BASIC; electronic engineering computing; elemental semiconductors; equivalent circuits; integrated circuit design; micromechanical devices; silicon; three-dimensional integrated circuits; .csv format; 2D interposer model; 3D interposer model; Microsoft Visual C++6.0; OpenGL coordination; RLC parameter; Si; equivalent circuit; hollow cube; hollow cylinder; microsystem interposer designer software; research and development; screen coordinate conversion; through silicon via; Graphics; Integrated circuit modeling; Machine vision; Mice; Software; Solid modeling; Through-silicon vias; Si Interposer; TSV; coordinate convertion algorithm;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on
Conference_Location :
Guilin
Print_ISBN :
978-1-4673-1682-8
Electronic_ISBN :
978-1-4673-1680-4
Type :
conf
DOI :
10.1109/ICEPT-HDP.2012.6474586
Filename :
6474586
Link To Document :
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