DocumentCode :
3501869
Title :
Interfacial reaction of heat-sink during vacuum and reflow soldering in space power electronics
Author :
Yarong Chen ; Meng Yang ; Binbin Zhang ; Rong An
Author_Institution :
Beijing Spacecrafts, Beijing, China
fYear :
2012
fDate :
13-16 Aug. 2012
Firstpage :
186
Lastpage :
188
Abstract :
The heat-sink interfacial reaction of Sn-90Pb, Sn-95Pb, Sn-37Pb solders are contrast with the Sn-3.0Ag-0.5Cu solder in vacuum soldering and reflow soldering in this paper, to find the matching solder combination. Results show that, Sn-90Pb, Sn-95Pb solders are not the good choices for Al2O3/MoCu in vacuum soldering. Sn-3.0Ag-0.5Cu and Sn-37Pb solders can be used in the vacuum soldering, and Sn-37Pb solder is the best choice as the leaded solders for space use.
Keywords :
heat sinks; power electronics; reflow soldering; Al2O3-MoCu; Sn-Ag-Cu; SnPb; heat sink interfacial reaction; reflow soldering; space power electronics; vacuum soldering; Coatings; Heating;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on
Conference_Location :
Guilin
Print_ISBN :
978-1-4673-1682-8
Electronic_ISBN :
978-1-4673-1680-4
Type :
conf
DOI :
10.1109/ICEPT-HDP.2012.6474597
Filename :
6474597
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3501869
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