DocumentCode :
3502007
Title :
Research on electroplating process of SiC/Al electronic packaging composites
Author :
Wang Kaikun ; Du Jianquan ; Yang Lei
Author_Institution :
Sch. of Mater. Sci. & Eng., Univ. of Sci. & Technol., Beijing, China
fYear :
2012
fDate :
13-16 Aug. 2012
Firstpage :
208
Lastpage :
211
Abstract :
In this study, in order to improve the surface properties and weldability of the high volume fraction SiC/Al composites, a novel method of nickel gold plating technology was investigated. Bright, dense, uniform, continuous nickel-gold plating layers formed on the surface of the composite, micrograph and composition of the layers were observed and analysed respectively. The experiment results showed that, the interface adhesion between the coatings and composite substrate is improved by the special process, and no impurities were found both in the Ni layers and Au layers. In addition, quality, thickness, conductivity, and air tightness of the coating layers were detected in the testing laboratory. The results showed that above performances of the layers met the requirement of the electronic packaging shell, and the plating layers offered good weldability.
Keywords :
composite materials; electronics packaging; electroplating; composite substrate; continuous nickel gold plating layers; electronic packaging composites; electronic packaging shell; electroplating process; micrograph; nickel gold plating technology; weldability; Adhesives; Gold; Nickel; Silicon carbide; Substrates; Surface treatment; Welding; Coating morphology; EDX; Electroless nickel plating; Gold plating; SiC/Al composites;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on
Conference_Location :
Guilin
Print_ISBN :
978-1-4673-1682-8
Electronic_ISBN :
978-1-4673-1680-4
Type :
conf
DOI :
10.1109/ICEPT-HDP.2012.6474602
Filename :
6474602
Link To Document :
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