Inverse analysis of solder joint creep properties

Author

Kamara, E. ; Lu, Hai-Han ; Bailey, Christopher ; Thomas, O. ; Di Maio, D. ; Hunt, C. ; Fulton, I.

Author_Institution

Univ. of Greenwich, London, UK

fYear

2012

fDate

13-16 Aug. 2012

Firstpage

275

Lastpage

279

Abstract

Experimental results from shear test on solder joints and Finite Element analysis method have been used to improve the creep constitutive equation for lead free SnAgCu solder alloy. Parameters in Anand´s viscoplastic model that are most sensitive to the solder joint´s stress-strain relationship have been identified and then modified in an inverse Finite Element analysis so that the new constitutive equation can be used as input data for computer simulation that predict behaviour and reliability of solder joints.

Keywords

copper alloys; creep testing; finite element analysis; reliability; silver alloys; soldering; solders; stress-strain relations; tin alloys; viscoplasticity; Anand viscoplastic model; SnAgCu; computer simulation; creep constitutive equation; inverse finite element analysis; reliability; shear testing; solder joint creep property; stress-strain relationship; Analytical models; Design methodology; Instruments; Iron; Mathematical model; Simulation; Strain;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on

Conference_Location

Guilin

Print_ISBN

978-1-4673-1682-8

Electronic_ISBN

978-1-4673-1680-4

Type

conf

DOI

10.1109/ICEPT-HDP.2012.6474617

Filename

6474617