Title :
Wetting of Sn-0.7Cu solder alloy on different substrates at different temperatures
Author :
HengGang Yin ; Jun Shen ; Qin Tang
Author_Institution :
Dept. of Mater. Sci. & Eng., Chongqing Univ., Chongqing, China
Abstract :
In this paper, the wettability of Sn-0.7Cu solder alloy on different substrates (Cu, Cu/Ni, Cu/Ni/Au and Cu/Ni/Ag) at different temperatures (530 K, 560 K and 590 K respectively) were investigated by microstructural observations, phase analysis and wetting tests. The results showed that the wettability of Sn-0.7Cu solder alloy improved with the increase of reflowing temperature due to the decrease of viscosity of molten Sn-0.7Cu alloy. The wettability of Sn-0.7Cu solder alloy on Cu/Ni/Au and Cu/Ni/Ag substrates is better than that of Cu substrate due to the rapid dissolution rates of Au/Ag in molten Sn-0.7Cu alloy. While, because the growth rate of intermetallic compound on Ni substrate is lower than that of Cu substrate, the wettability of Sn-0.7Cu solder alloy on Cu substrate is better than that of Cu/Ni substrate.
Keywords :
copper alloys; solders; tin alloys; wetting; Cu-Ni-Ag; Cu-Ni-Au; Sn-Cu; intermetallic compound growth rate; microstructural observations; molten alloy viscosity; phase analysis; solder alloy wettability; temperature 530 K; temperature 560 K; temperature 590 K; wetting tests; Abstracts; Gold; Microstructure; Nickel; Substrates; Viscosity; Sn-0.7Cu solder; dissolution rate; interfacial reaction; viscosity; wettability;
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on
Conference_Location :
Guilin
Print_ISBN :
978-1-4673-1682-8
Electronic_ISBN :
978-1-4673-1680-4
DOI :
10.1109/ICEPT-HDP.2012.6474618
