DocumentCode
3502359
Title
A Triple Deck Ceramic Sringle Chip Package For High Frequency Communication Integrated Circuits
Author
Bedouani, M.
Author_Institution
Bull S. A. Research Center
Volume
2
fYear
1993
fDate
2-5 Aug 1993
Firstpage
683
Lastpage
688
Keywords
Attenuation; Ceramics; Communication system control; Conductors; Coplanar transmission lines; Coupling circuits; Frequency measurement; Impedance measurement; Integrated circuit packaging; Stripline;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Conference/Brazil, 1993., SBMO International
Print_ISBN
0-7803-1288-0
Type
conf
DOI
10.1109/SBMO.1993.587230
Filename
587230
Link To Document