DocumentCode :
3502359
Title :
A Triple Deck Ceramic Sringle Chip Package For High Frequency Communication Integrated Circuits
Author :
Bedouani, M.
Author_Institution :
Bull S. A. Research Center
Volume :
2
fYear :
1993
fDate :
2-5 Aug 1993
Firstpage :
683
Lastpage :
688
Keywords :
Attenuation; Ceramics; Communication system control; Conductors; Coplanar transmission lines; Coupling circuits; Frequency measurement; Impedance measurement; Integrated circuit packaging; Stripline;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Conference/Brazil, 1993., SBMO International
Print_ISBN :
0-7803-1288-0
Type :
conf
DOI :
10.1109/SBMO.1993.587230
Filename :
587230
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3502359
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