DocumentCode
3502417
Title
Influence of segregation and diffusion behavior on electrical properties of embedded Ni- Cr thin film resistor
Author
Lifei Lai ; Rong Sun ; Xianzhu Fu ; Ruxu Du
Author_Institution
Shenzhen Inst. of Adv. Technol., Shenzhen, China
fYear
2012
fDate
13-16 Aug. 2012
Firstpage
298
Lastpage
301
Abstract
The segregation and diffusion of Ni-Cr embedded thin film resistor (ETFR) materials under different annealing conditions were investigated. Strong segregation and diffusion were caused by annealing at high temperature. The electrical properties of Ni- Cr ETFR were affected by segregation and diffusion of metal, which led unstable TCR and large resistivity.
Keywords
annealing; chromium; nickel; thin film resistors; ETFR materials; Ni-Cr; annealing condition; diffusion behavior; electrical properties; embedded nickel-chromium thin film resistor; metal diffusion; metal segragation; segregation behavior; Annealing; Copper; Films; Nickel; Resistors;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on
Conference_Location
Guilin
Print_ISBN
978-1-4673-1682-8
Electronic_ISBN
978-1-4673-1680-4
Type
conf
DOI
10.1109/ICEPT-HDP.2012.6474622
Filename
6474622
Link To Document