• DocumentCode
    3502831
  • Title

    Question: DRC or DfM? Answer: FMEA and ROI

  • Author

    Balasinski, Artur

  • Author_Institution
    Cypress Semicond., San Jose, CA
  • fYear
    2006
  • fDate
    27-29 March 2006
  • Lastpage
    794
  • Abstract
    Design for manufacturability (DfM) is a design verification methodology linked to a set of requirements that can be perceived as gray area within the design rule check (DRC) approach based on rigid pass/fail criteria. This is because the DfM rules, unlike DRC, are not directly responsible for the functionality of individual devices, but are broadly scoped to address the die yield over the process corners. At the same time, all design rules are to ensure high performance and profit margins. Therefore, the distinction between DfM and DRC rules is often artificial and confusing. In this paper, we propose how to combine all design rules into one enforceable deck, regardless of their origin, and introduce an implementation cutoff lines decided by technology and business factors. This new methodology is based on the failure mode and effect analysis (FMEA) and return on investment (RoI). FMEA, involving the criticality, occurrence, and detectability of failure modes, is demonstrated for DfM rules focused on system on chip (SoC). The results are then correlated to those of the RoI approach for the same set of rules
  • Keywords
    design for manufacture; design for testability; failure analysis; system-on-chip; DRC; DfM; FMEA; ROI; design for manufacturability; design rule check; design verification; enforceable deck; failure mode and effect analysis; return on investment; rigid pass/fail criteria; Degradation; Design engineering; Design for manufacture; Design methodology; Failure analysis; Integrated circuit yield; Investments; Manufacturing; Semiconductor device manufacture; System-on-a-chip;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Quality Electronic Design, 2006. ISQED '06. 7th International Symposium on
  • Conference_Location
    San Jose, CA
  • Print_ISBN
    0-7695-2523-7
  • Type

    conf

  • DOI
    10.1109/ISQED.2006.110
  • Filename
    1613232