Development of flexible Cu-MWCT composite thin film for functional applications

Flexible films of Cu-MCNT composites were fabricated by electrodeposition from an optimized copper bath. The substrate used is polythene film that was predeposited with electroless copper as a seed layer for conduction. An optimized amount of CNT was incorporated into copper bath and the deposition was done at quiescent and agitation condition. The adhesion of the seed layer and the upper electrodeposited composite layer was good as revealed from bend test. The electrical as well as physical-mechanical property of the film was improved with respect to applied condition. The topography and the texture of the metal-CNT deposit were characterized with respect to various analyses.