DocumentCode
3503703
Title
TSV modeling and thermal analysis based on 3D package
Author
Wenchao Tian ; Wenlong Wang ; Hongming Wang
Author_Institution
Sch. of Electro-Mech. Eng., Xidian Univ., Xi´´an, China
fYear
2012
fDate
13-16 Aug. 2012
Firstpage
546
Lastpage
548
Abstract
TSV heat models with different pitches, straight through holes and circular truncated cones are established. Simulation results are obtained, and compared with wire bonding results. The conclusion that the heat dissipation effect of TSV technology is better than that of wire bonding technology is obtained. Heat dissipation effect has nothing to do with TSV shape under the same TSV pitches.
Keywords
cooling; integrated circuit modelling; integrated circuit packaging; thermal analysis; three-dimensional integrated circuits; 3D packaging; TSV heat modeling; circular truncated cone; heat dissipation effect; straight through hole; thermal analysis; wire bonding technology; Abstracts; Through-silicon vias; 3D lamination; TSV; electronic packaging;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on
Conference_Location
Guilin
Print_ISBN
978-1-4673-1682-8
Electronic_ISBN
978-1-4673-1680-4
Type
conf
DOI
10.1109/ICEPT-HDP.2012.6474677
Filename
6474677
Link To Document