Design of die-pad on exposed substrate (DOES) leadframe package for DDR3 interface applications

The fabless semiconductor companies always use the mature packages provided by the assembly houses. The cost and package selection trade-off shall be taken for different marketing segments. An innovative leadframe package was proposed with a cost competitiveness that increased more leads for digital TV applications compared to conventional leadframe package. The full channel from controller chip side to DRAM chip side was simulated and analyzed in the frequency and time domains. Results indicated that selection of proper ODT and drive strength achieves acceptable timing and voltage margins for DDR3 1350 Mb/s applications using the leadframe package on a two-layer PCB.