Numerical simulation on heating source of 3D electronic packaging

Based on Deform software, we studied the problems under heating source during the working process of electronic packaging with materials SiCp/Al composite. First we constructed a three-dimensional finite element numerical analysis model, then analyzed the thermal field of packaging by single constant heating source, understand its working state and operating failure estimation, push forward available project of improve the electronic package structure by change the simulation parameters, for example, the material size and type. The simulation result shows that, the materials´ heat capacity and heat transfer coefficient affect the heat transfer property of material directly. Numerical analysis results provides theoretical basis for improving the reliability and optimizing design of the packaging.