Optimal thermal design of a high power package using the design of experiment (DOE)

Thermal management for package assembly, especially for high power packages, is very important to the reliability and quality of electrical products. In this paper, a finite element approach is proposed to investigate the thermal performance of TO252-5L(B) package attached on printed circuit board(PCB) with different layers and sizes, which is further related to reliability issue of this type of IC package. This single-factor method shows change trend of thermal resistance following materials and dimensions of package. Furthermore, design of experiment (DOE) approach is used to find the main factors and optimal combination of these control factors for minimizing of the thermal resistance for packages. The simulation results show that thermal conductivity of adhesive, die to die pad ratio, thermal conductivity of EMC and thermal test PCB board have significant impact on thermal resistance of T0252. In addition, interactions of those factors are also prominent, and the minimum thermal resistance of T0252 is 30.46K/W after optimization.