Dynamic model for analyzing the motion of molten solder during self-assembly

Author

Lei Yang ; Chunqing Wang ; Wei Liu ; Yanhong Tian

Author_Institution

Sch. of Mater. Sci. & Eng., Harbin Inst. of Technol., Harbin, China

fYear

2012

fDate

13-16 Aug. 2012

Firstpage

649

Lastpage

652

Abstract

Energy-based static model is inappropriate for analyzing the solder-components interactions in surface tension powered MEMS self-assembly. A 2-D model based on fluid dynamics is presented to investigate the dynamic motion of molten solder during self-assembly. In addition, a dynamic contact angle, which is based on the TPL mobility coefficient and serves as a more appropriate boundary condition, is presented for the dynamic wetting of molten solder. Then a numerical validation demonstrates the feasibility of the model predicting the dynamic motions of solder and components in self-assembly. This dynamic model can also be improved to depict the similar coupled solder-components interactions in electronics packaging.

Keywords

computational fluid dynamics; contact angle; electronics packaging; microfabrication; micromechanical devices; self-assembly; solders; surface tension; wetting; TPL mobility coefficient; boundary condition; coupled solder-components interactions; dynamic contact angle; electronics packaging; energy-based static model; fluid dynamics-based 2D model; model prediction; molten solder dynamic motion; molten solder dynamic wetting; numerical validation; solder-components interactions; surface tension powered MEMS self-assembly; Abstracts; Self-assembly;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on

Conference_Location

Guilin

Print_ISBN

978-1-4673-1682-8

Electronic_ISBN

978-1-4673-1680-4

Type

conf

DOI

10.1109/ICEPT-HDP.2012.6474701

Filename

6474701