A novel shielding structure based on TSV 3D package

3D integration technology, especially TSV (Through Silicon Via) based 3D package is a feasible solution for high density and high performance system. The TSV provides a vertical interconnection with a much shorter electrical delay between dies. The EMI (Electromagnetic Interfere) issue draws great attention due to the short vertical distance between noise source circuit and sensitive circuit. In this paper, we proposed a novel shielding structure to suppress the space electromagnetic coupling for the 3D integration application. According to the simulation data, the insertion loss of the novel shielding structure is below -65dB from DC to 30GHz for wide band vertical shielding. The novel structure also provides a significant noise suppression performance for 2D electromagnetic coupling. The insertion loss between 2D noise and sensitive dies are below -60dB from DC to 40GHz.