Study on the warpage and thermal stress in wire bonding and C4 stacked chip package

Stacked chip scale packaging has many good properties, such as higher packaging density, smaller signal delaying and better interconnection, which becomes one important technique of realizing 3D packaging. In this paper, the warpage and thermal stress of a three-chip stacked package which use wire-bonding connection and C4 connection during process was respectively analyzed and compared each other.