Design and analysis of 2D embedded passive devices in printed circuit boards

Author

Jing Zhang ; Baoxia Li ; Lixi Wan ; Liqiang Cao

Author_Institution

Inst. of Microelectron., Beijing, China

fYear

2012

fDate

13-16 Aug. 2012

Firstpage

745

Lastpage

748

Abstract

Embedded passives devices are becoming increasingly important for next generation miniaturized systems. A Printed circuit boards (PCBs) is investigated in this paper with focus on passive devices. Film resistance, capacitance and inductance are embedded into the same board. The effects of embedded capacitors and inductance on signal integrity (SI) and electromagnetic compatibility (EMC) have been simulated, measured , and compared with measured results derived from conventional discrete capacitors. A finite element, full-wave method was used to simulate and analyze the transmission characteristics.

Keywords

capacitors; electromagnetic compatibility; finite element analysis; passive networks; printed circuits; 2D embedded passive device analysis; EMC; PCB; discrete capacitors; electromagnetic compatibility; embedded capacitors; film resistance; finite element full-wave method; next generation miniaturized systems; printed circuit boards; signal integrity; transmission characteristic analysis; Abstracts; Capacitors; Inductance; Inductors; Materials; Resistance; Resistors;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on

Conference_Location

Guilin

Print_ISBN

978-1-4673-1682-8

Electronic_ISBN

978-1-4673-1680-4

Type

conf

DOI

10.1109/ICEPT-HDP.2012.6474722

Filename

6474722