Thermo-mechanical characteristics of indium micro-joint under various low-temperature excursions

Properties of an indium joint used as interconnection in pixelated detector systems play a key role in determining their functionality since each indium joint represents a pixel, which defines a resolution limit of the sensor. Additionally, such detectors are required to operate at cryogenic temperatures. Thus, the thermal conditions that indium joints in service life can be harsh, for example, changing from room temperature to liquid-nitrogen temperature. In this paper, thermo-mechanical characteristics of indium joints under various low-temperature excursions were investigated numerically. This approach provides a useful tool for the better understanding of a thermo-mechanical response of such system to various in-service conditions as well as their reliable performance.