Dynamic analysis of bare printed circuit board under impact

This paper presents the fundamental understandings of the printed circuit board (PCB) dynamic behaviors under impact loading, with the use of finite element analysis for different configurations of boards. The effects of boundary conditions, and the impulse duration are also investigated. Excellent agreement is obtained between the bare board analysis and the actual component performance for the current JESD22-B111 drop test board. Then the same methodology is extended to a square-shape board. The guidelines for the future component placement and the selection of board dimension and component size are discussed. Fundamental frequencies of the different board configurations are calculated and compared. In addition, new impulse profile is proposed to obtain the board dynamic responses without ringing effect. This new impulse profile provides much convenience in the future for the analysis of drop test related failures.