On the precision synthesis of the bonder in flip-chip equipment

Author

Dawei Zhang ; Meifa Huang ; Zhiyue Wang ; Bing Kuang ; Mengmeng Xiao

Author_Institution

Sch. of Mech. & Electr. Eng., Guilin Univ. of Electron. Technol., Guilin, China

fYear

2012

fDate

13-16 Aug. 2012

Firstpage

971

Lastpage

974

Abstract

Because of small size and light mass, flip-chip bonding technology is widely used in packaging industry. The precision of bonder directly determines the quality of flip-chip. Based on theory of small displacement torsor (SDT), the tolerance model of the bonder with the thermal deformation is built. Compared with the tolerance model without thermal deformation, the influence of temperature on the bonding precision will be found. This paper considers the influences of working temperature of the bonder. Thermal analysis of boner is carried out and thermal deformation is obtained. The work done in this article provides the theoretical foundation for design of insulation.

Keywords

deformation; flip-chip devices; thermal analysis; SDT theory; bonder precision synthesis; bonder tolerance model; bonder working temperature; flip-chip bonding technology; flip-chip equipment; flip-chip quality; insulation design; packaging industry; small-displacement torsor; thermal analysis; thermal deformation; Abstracts; Force; Vectors; Bonder of flip-chip; SDT; Thermal and mechanical analysis; Tolerance model;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on

Conference_Location

Guilin

Print_ISBN

978-1-4673-1682-8

Electronic_ISBN

978-1-4673-1680-4

Type

conf

DOI

10.1109/ICEPT-HDP.2012.6474768

Filename

6474768