• DocumentCode
    3505690
  • Title

    Optimal design of work stage mounting system of precision packaging equipment

  • Author

    Hui Jing ; Cong Li ; Fuyun Liu ; Bing Kuang

  • Author_Institution
    Sch. of Mech. & Electr. Eng., Guilin Univ. of Electron. Technol., Guilin, China
  • fYear
    2012
  • fDate
    13-16 Aug. 2012
  • Firstpage
    1015
  • Lastpage
    1018
  • Abstract
    High precision packaging equipments need high precision isolator to reduce the vibration transmission from outside to work stage. Nowadays, a useful and effective way for vibration isolating is to employ the proper mounting systems to reduce the vibration. One useful method for helping the design engineer to develop more effective mounting systems is through optimization techniques. Sequential Quadratic Programming (SQP) is an effective optimization technique in many engineering fields. In this paper, design optimization of work stage mounting system based on SQP method for vibration control is presented. The optimization objective is to find the highest decoupling ratio of the each mount while selecting the stiffness and orientations of individual mount. The constraints are imposed to keep the desired decoupled ratio in each orientation and the frequency corresponding to the decoupled ratio. A case study is given to validate the proposed method. The result shows that the value of optimized system, such as decoupling ratio, is improved significantly. Therefore, the method proposed in this paper is effective for the optimization of work stage mounting system.
  • Keywords
    design engineering; elasticity; packaging machines; precision engineering; quadratic programming; vibration isolation; SQP method; decoupling ratio; high-precision isolator; high-precision packaging equipments; optimal design; optimization techniques; orientation selection; sequential quadratic programming; stiffness selection; vibration control; vibration isolation; vibration transmission reduction; work stage mounting system; Abstracts; Acceleration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on
  • Conference_Location
    Guilin
  • Print_ISBN
    978-1-4673-1682-8
  • Electronic_ISBN
    978-1-4673-1680-4
  • Type

    conf

  • DOI
    10.1109/ICEPT-HDP.2012.6474779
  • Filename
    6474779