DocumentCode
3505870
Title
System analysis of wafer logistics information management for IC packaging foundry in Taiwan
Author
Liu, Yu-Chuan
Author_Institution
Dept. of Inf. Manage., Tainan Univ. of Technol., Tainan
Volume
2
fYear
2008
fDate
12-15 Oct. 2008
Firstpage
2445
Lastpage
2450
Abstract
The IC manufacturing related business had been remarkably developed for the past decade in Taiwan. In addition to the well-known wafer fabrication industries, the IC design house and IC packaging/testing business together form a contiguous supply chain form material to system in Taiwan. Logistics and information management of the wafer is the key linkage in the wafer foundry process. The objectives of this paper are to firstly review the issues of global wafer logistics from wafer fabrication to IC packaging. Secondly, an operation model for wafer logistics management in IC packaging foundry will be developed. Development of this research is not only essential for the computerization and automation of the wafer warehousing, but also the kernel of the e-business for IC packaging business.
Keywords
foundries; integrated circuit design; integrated circuit manufacture; logistics; wafer level packaging; warehousing; IC design house; IC manufacturing; IC packaging foundry; Taiwan; contiguous supply chain form; e-business; wafer fabrication industry; wafer logistics information management; wafer warehousing; IC foundry; logistics management; supply chain management;
fLanguage
English
Publisher
ieee
Conference_Titel
Service Operations and Logistics, and Informatics, 2008. IEEE/SOLI 2008. IEEE International Conference on
Conference_Location
Beijing
Print_ISBN
978-1-4244-2012-4
Electronic_ISBN
978-1-4244-2013-1
Type
conf
DOI
10.1109/SOLI.2008.4682946
Filename
4682946
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