• DocumentCode
    3505870
  • Title

    System analysis of wafer logistics information management for IC packaging foundry in Taiwan

  • Author

    Liu, Yu-Chuan

  • Author_Institution
    Dept. of Inf. Manage., Tainan Univ. of Technol., Tainan
  • Volume
    2
  • fYear
    2008
  • fDate
    12-15 Oct. 2008
  • Firstpage
    2445
  • Lastpage
    2450
  • Abstract
    The IC manufacturing related business had been remarkably developed for the past decade in Taiwan. In addition to the well-known wafer fabrication industries, the IC design house and IC packaging/testing business together form a contiguous supply chain form material to system in Taiwan. Logistics and information management of the wafer is the key linkage in the wafer foundry process. The objectives of this paper are to firstly review the issues of global wafer logistics from wafer fabrication to IC packaging. Secondly, an operation model for wafer logistics management in IC packaging foundry will be developed. Development of this research is not only essential for the computerization and automation of the wafer warehousing, but also the kernel of the e-business for IC packaging business.
  • Keywords
    foundries; integrated circuit design; integrated circuit manufacture; logistics; wafer level packaging; warehousing; IC design house; IC manufacturing; IC packaging foundry; Taiwan; contiguous supply chain form; e-business; wafer fabrication industry; wafer logistics information management; wafer warehousing; IC foundry; logistics management; supply chain management;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Service Operations and Logistics, and Informatics, 2008. IEEE/SOLI 2008. IEEE International Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4244-2012-4
  • Electronic_ISBN
    978-1-4244-2013-1
  • Type

    conf

  • DOI
    10.1109/SOLI.2008.4682946
  • Filename
    4682946