Finite element modeling of the effects of mounting stresses on the frequency temperature behavior of surface acoustic wave devices

Author

Stewart, J.T. ; Chen, D.P.

Author_Institution

Vectron Technol. Inc., Hudson, NH, USA

Volume

1

fYear

1997

fDate

5-8 Oct 1997

Firstpage

105

Abstract

A general finite element method has been developed for the analysis of the effects of thermally induced mounting stresses on the first order temperature behavior of SAW devices. The present study analyzes this behavior using a finite element model to obtain an accurate description of the thermal stresses and deformations in a crystal plate that has been mounted in various configurations using an adhesive to bond the quartz into a ceramic package. This solution is then combined with an analytical solution of the SAW mode shape for an arbitrary transverse harmonic in a general perturbation procedure to obtain the frequency shift. The methods developed herein are useful for studying the sensitivity of a particular mounting scheme to thermal stresses for small temperature excursions. Examples of thermal effects on SAW propagation are presented for various mounting schemes

Keywords

finite element analysis; perturbation theory; surface acoustic wave devices; thermal stresses; SiO₂; adhesive; ceramic package; crystal plate; deformation; finite element model; frequency shift; mounting stress; perturbation method; quartz bonding; surface acoustic wave device; temperature excursion; thermal stress; transverse harmonic; Bonding; Ceramics; Deformable models; Finite element methods; Harmonic analysis; Packaging; Surface acoustic wave devices; Surface acoustic waves; Temperature; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

Ultrasonics Symposium, 1997. Proceedings., 1997 IEEE

Conference_Location

Toronto, Ont.

ISSN

1051-0117

Print_ISBN

0-7803-4153-8

Type

conf

DOI

10.1109/ULTSYM.1997.662989

Filename

662989